To provide a plating method by which a base material can be plated as a film having a uniform thickness, and treatment efficiency can be enhanced by reducing the number of processes.
Long base materials 2 are delivered one by one from a delivery roll 7. At first, the long base material 2 is dipped into a catalytic liquid 9 in a catalytic treatment tank 4, so that a catalyst is stuck to the long base material 2. Next, in a plating treatment tank 5, the long base material 2 is dipped into a plating liquid 10, further, a low electric current of ≤10 A/m2 is allowed to flow to the space between the long base material 2 as a cathode and the plating liquid 10, so that a plating film is formed on the surface of the long base material 2. By the plating method, a metal can forcedly be deposited on the surface of the long base material 2 even if the adhesion of the catalyst is insufficient, so that the metal can stably be deposited on the surface of the long base material 2, and a plating film having a uniform thickness can be formed.
KOMATSUBARA MAKOTO
KANEKAWA HITONORI
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