PURPOSE: To execute a plating post-treatment by improving the adhesion property of plating layers formed on the outermost layers of external electrodes of electronic parts, and further, to prevent the electrification of the electronic parts as far as possible.
CONSTITUTION: The first purpose is attained by subjecting the electronic parts to barrel polishing to crush and smooth the plating layers consisting of particles of a metal or alloy having good wettability with solder on the surfaces of the external electrodes of the electronic parts. The surface roughness Ra of the plating layers is preferably Ra≤0.6μm and more particularly preferably Ra≤0.5μm. The metal or alloy consists of Sn or Sn/Pb. The barrel polishing may be of a dry processing or wet processing. The second purpose is attained by coating the barrel polished electronic parts with an antistatic agent. This antistatic agent may be a siloxane based antistatic agent or surfactant based antistatic agent.
ITO MITSUYOSHI
HONDA TOSHIMITSU
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