To prevent edge sagging of the surface of a polished object caused by polishing by forming a polisher for polishing the surface of the polished object, of curved material of epoxy resin with nylon powder added thereto, and forming this polisher directly on a surface table or bonding it with a bond.

A polishing device for CMP(chemical mechanical polishing) ideally used for flattening polishing of a semiconductor device is provided with a polisher 1 directly formed on the upper face of a surface table 2. At the time of manufacturing this polisher 1, a resin mixture 6 obtained by adding nylon powder to a main agent and a curing agent of epoxy resin is made drip on the surface table 2 held to a polisher manufacturing tool 8. A clad sheet 9 of plane shape with a mold release agent applied thereto is fitted to the polisher manufacturing tool 8 and pressed to the resin mixture 6 from above to set the thickness of the polisher 1. After being cured by heating, the resin mixture 6 is separated from the clad sheet 9, and a groove for a polishing solution to pass is formed in the cured material to complete the polisher 1.