To dress a polishing pad simultaneously with polishing a workpiece by polishing the workpiece while feeding slurry of abrasive material that can polish only a bond of the polishing pad, using the polishing pad formed of compound material of abrasive grains and a bond formed of a polymeric compound for holding the abrasive grains.

A polishing pad 16 is fixed to the upper face of a surface table 11 rotated by rotatory-drive mechanism through a rotary shaft 15, and a wafer 14 held to a holding part 13 is pressed to the polishing pad 16 to polish the wafer 14. The polishing pad 16 is formed of compound material of abrasive grains 17 for polishing the wafer 14 and a bond 18, a binder for holding the abrasive grains 17. During the time of polishing the wafer 14, slurry 20 is fed to the upper face of the pad 16, but in this case, abrasive grains with hardness to the extent of being able to polish the bond 18 without flawing the wafer 14 are mixed in the slurry 20. The polishing face on the upper face of the pad 16 is thereby polished by floating abrasive grains contained in the slurry 20 simultaneously with polishing the wafer 14 with the abrasive grains 17.