To provide a polishing state determining device performing a measurement to accurately recognize the state of a polishing pad polishing a semiconductor wafer, and also to provide a polishing device having the polishing state determining device and a manufacturing method of a semiconductor device using the polishing device.
In this polishing state determining device 100, the state of the polishing pad 6 to which slurry is supplied is determining in a CMP (Chemical Mechanical Polishing) device for polishing the surface of the semiconductor wafer by performing a relative motion of the semiconductor wafer and the polishing pad 6, while pressing the surface of the semiconductor wafer to the polishing pad 6. The polishing state determining device 100 has a light transmission member 2 and an outer peripheral member 5a. The light transmission member 2 has a surface pressed on the polishing pad 6. The outer peripheral member 5a is projected to the polishing pad 6 side more than the surface pressed on the polishing pad 6 of the light transmission member 2 in a position for surrounding the light transmission member 2.
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Nobuo Arakawa
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