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Title:
POLISHING METHOD IN POLISHING DEVICE
Document Type and Number:
Japanese Patent JPH0453670
Kind Code:
A
Abstract:

PURPOSE: To execute the curved face polishing of a recessed face or projecting face and a surface polishing with one polish-device, by rocking a spindle shaft, moving the spindle shaft horizontally and inclining the spindle shaft.

CONSTITUTION: A plate face 3 and the lower face of a work W are opposed and also rocked with the work being vacuum-attracted onto a chuck face 4 to perform polishing, and a projetting face is polished with the center part of the work W being moved to the inner peripheral edge of the plate face 3 by a moving mechanism and also the outer peripheral edge 3a side of the plate face of the lower face of the work W being made at the angle of elevation by an inclination mechanism. Recessed face polishing is then performed with the center of the work W being moved to the outer peripheral edge of the plate face 3 by the moving mechanism and also the inner peripheral edge 3b side of the lower face of the work W being made at the angle of elevation by the inclination mechanism.


Inventors:
SAKAI KOZO
Application Number:
JP15979890A
Publication Date:
February 21, 1992
Filing Date:
June 20, 1990
Export Citation:
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Assignee:
RATSUPUMASUTAA ESU EFU TEI KK
International Classes:
B24B37/00; (IPC1-7): B24B37/00
Domestic Patent References:
JPS61274873A1986-12-05
JPH02139163A1990-05-29