POLISHING PAD AND ITS MANUFACTURING METHOD

Title:

POLISHING PAD AND ITS MANUFACTURING METHOD

Document Type and Number:

Japanese Patent JP2002011652

Kind Code:

A

Abstract:

To provide a polishing pad having hydrophilic nature and durability and used in a CMP improved in maintenance of polishing slurry on a pad surface.

A sheet formed of hydrophilic fibers is caused to carry 20-90 wt.% hydrophilic high molecules.

Inventors:

HIGASHIYAMA SATORU
MURAMOTO TEI
SAITO HIDENAO
TOMINAGA SHIGERU
TAIRA TETSUJI

Application Number:

JP2000192497A

Publication Date:

January 15, 2002

Filing Date:

June 27, 2000

Export Citation:

Assignee:

RENGO CO LTD
ROKI TECHNO CO LTD
ACE KK

International Classes:

B24B37/20; B24B37/24; H01L21/304; (IPC1-7): B24B37/00; H01L21/304

Attorney, Agent or Firm:

Bunji Kamata (2 outside)

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