PURPOSE: To provide a polishing device which can uniform load distribution over a semiconductor wafer.
CONSTITUTION: A pressure plate 4 in a polishing device is composed of a first plate 1 is composed of a first plate 1, attached at the center of its one surface with a pressure rod 3, a second plate positioned facing the first plate 1 and adapted to hold a semiconductor wafer 8, and a load distributing ring 11 located between the first and second plates 1, 2, for distributing a load applied upon the first plate and directed toward a base plate 5 before the load is transmitted to the second plate 2. With this arrangement in which the load applied around the center of the first plate 1 by the pressure rod 3 is distributed by the distributing ring 11 and then is transmitted to the second plate 2, and the load is uniformly applied over the semiconductor wafer 8 supported to the second plate 2, thereby it is possible to polish the semiconductor surface with a high degree of flatness.
| JP6225088 | A grinding method and a polish device |
| JP3998781 | Wafer pressurization method |
| JP2007035782 | SUBSTRATE POLISHING METHOD |
KAIDA HIROMASA
NISHIYORI KENICHI
HITACHI TOKYO ELECTRONICS