Title:
PRINTED BOARD
Document Type and Number:
Japanese Patent JPH07226579
Kind Code:
A
Abstract:
PURPOSE: To prevent design failure in board design wherein a CAD system is used.
CONSTITUTION: Lands 9, 10 for soldering a part are enlarged wider than electrodes 4, 5 or a part outer shape range 6 of a part 3 to be mounted, and are printed in a printed board. Solder resists 12, 13 are applied to the lands 9, 10 making a solder effective region remain. For CAD design, the lands 9, 10 are regarded as a part outer shape range and a wiring pattern is designed. Then, designing is possible without causing design failure of shortcircuiting of a pattern 11 with the electrode 5 in a printed board. Since designing regarding the lands 9, 10 as a part outer shape range is possible, it is not required to set a macro arrangement forbidden region.
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Inventors:
OZAWA KIYOSHI
KATSUKI KENICHI
SEKINO YOSHIYUKI
TANPO HIROAKI
KATSUKI KENICHI
SEKINO YOSHIYUKI
TANPO HIROAKI
Application Number:
JP3647494A
Publication Date:
August 22, 1995
Filing Date:
February 09, 1994
Export Citation:
Assignee:
SONY CORP
International Classes:
H05K3/34; (IPC1-7): H05K3/34
Attorney, Agent or Firm:
Takashi Shibuya
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