Title:
PROJECTION ALIGNER AND EXPOSURE METHOD/DEVICE
Document Type and Number:
Japanese Patent JP3275879
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To focus a shot area around a wafer, by setting prescribed width from the outer peripheral end of the wafer to be an inhibition band, and deciding a detection point for focusing based on the position relation of the inhibition band and the shot area.
SOLUTION: Prescribed width from the outer peripheral end WE of a wafer W is set to be an inhibition band. At the focusing of a shot area SA1 whose whole part is positioned on an outer side compared to the boundary LL of the inhibition band, a point Pff where a straight line K1 passing through a specified point SC1 in the shot area SA1 and the center point CCw of the wafer WA crosses the boundary line LL is adjusted to the detection point of a focus detection means. When the detection point of the focus detection means is positioned in the inhibition band and a shot area SA2 whose part exists on the inner side of the boundary line LL is focused, a point Psf which is on a straight line K2 passing through a point SC2 that is the nearest to the center point CCw of the wafer WA in the shot area SA2 and in the shot area SA2 on the inner side of the boundary line LL is adjusted to the detection point of the focus detection means.
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Inventors:
Hiroyuki Suzuki
Osamu Furukawa
Osamu Furukawa
Application Number:
JP19586499A
Publication Date:
April 22, 2002
Filing Date:
July 09, 1992
Export Citation:
Assignee:
NIKON CORPORATION
International Classes:
H01L21/027; G03F7/207; (IPC1-7): H01L21/027; G03F7/207
Domestic Patent References:
| JP63190334A |