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Patent Searching and Data


Title:
RESIN COMPOSITION, AND RESIN MOLDED BODY
Document Type and Number:
Japanese Patent JP2018053087
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition capable of obtaining a resin molded body excellent in bending elastic modulus.SOLUTION: A resin composition contains a thermoplastic resin, a carbon fiber, a clay mineral, and a resin containing at least one of an amide bond and an imide bond.SELECTED DRAWING: None

Inventors:
MORIYA HIROYUKI
MIYAMOTO TAKESHI
OGOSHI MASAYUKI
Application Number:
JP2016190267A
Publication Date:
April 05, 2018
Filing Date:
September 28, 2016
Export Citation:
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Assignee:
FUJI XEROX CO LTD
International Classes:
C08L101/00; C08K3/34; C08K7/06; C08L23/00; C08L23/26
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office