Title:
RESIN SEALED TYPE PHOTOCOUPLED SEMICONDUCTOR AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH0194679
Kind Code:
A
Abstract:
PURPOSE:To obtain a resin sealed photocoupled semiconductor device with excellent dielectric strength and moisture proof and whose photoconductive efficiency is not damaged by integrating a transmissive silicon hardened body, in which a semiconductor light emitting element and a semiconductor light receiving element are buried, with a sealing resin by bonding, while interposing a ultraviolet irradiation processing layer formed on such hardened silicon. CONSTITUTION:By optically coupling a semiconductor light emitting element 1 which is connected to an inner lead part 8 of an external connection lead 4 by a conductive material and a semiconductor light receiving element 2 which is connected to the inner lead part 8 of the external connection lead 4 by the conductive material, together with a part of the conductive material which is adjacent at least to the semiconductor elements 1, 2 and a part of the inner lead 8 in which the semiconductor elements 1, 2 are mounted, which is adjacent at least to semiconductor elements 1, 2, while burying them while bonding in a transmissive hardened silicone 5, a sealing resin 7 is formed by sealing the hardened silicone 5 together with the remainder of the inner lead part 8. In such a resin sealed semiconductor device, the silicon hardened body 5 is integrated by being bonded to the sealing resin 7 while interposing a ultraviolet irradiation processing layer 6 formed thereupon.
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Inventors:
KOGO AKIYOSHI
MINE KATSUTOSHI
YAMAKAWA KIMIO
MINE KATSUTOSHI
YAMAKAWA KIMIO
Application Number:
JP25223387A
Publication Date:
April 13, 1989
Filing Date:
October 06, 1987
Export Citation:
Assignee:
TORAY SILICONE CO
International Classes:
H01L23/29; G02B6/42; H01L23/31; H01L31/02; H01L31/12; (IPC1-7): H01L23/30; H01L31/02; H01L31/12
Domestic Patent References:
| JP62500106Y |
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