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Title:
SEMICONDUCTOR ADHESIVE SHEET
Document Type and Number:
Japanese Patent JP2013098443
Kind Code:
A
Abstract:

To provide an excellent semiconductor adhesive sheet which is capable of picking up a semiconductor element with an adhesive agent layer without fail even if there is heat storage of a collet.

A semiconductor adhesive sheet is configured by laminating a release film, an adhesive agent layer which is formed partially on the release film, and a viscous film which covers the adhesive agent layer and is formed in contact with the release film around the adhesive agent layer. When a tensile strength test is implemented with a gauge length of 100 mm and an inter-grip distance on a sample in a fancy strip shape with the width of 25 mm of the viscous film in accordance with JIS K 7127/2/300, the viscous film does not have a yield point in an elongation percentage until 20% and 5% modulus of the viscous film is 6.0 MPa or more.


Inventors:
INOMAE CHIKAKO
ISHIGURO KUNIHIKO
SUGIYAMA JIRO
Application Number:
JP2011241726A
Publication Date:
May 20, 2013
Filing Date:
November 02, 2011
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
H01L21/301; C09J7/02; C09J133/00; C09J161/06; C09J163/00; C09J167/00; C09J171/12; C09J175/04; C09J177/00; C09J179/08; C09J181/04; C09J181/06; C09J183/00; H01L21/52
Domestic Patent References:
JP2010135765A2010-06-17
JP2011184603A2011-09-22
JP2008088411A2008-04-17
JP2011216508A2011-10-27
JP2011204932A2011-10-13
Attorney, Agent or Firm:
Toshizo Iida
Naosuke Miyamae



 
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