Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2015225885
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an art to inhibit swelling of an electrode.SOLUTION: A semiconductor device 1 comprises: a semiconductor substrate 50; a plurality of first electrode layers 10 formed on the semiconductor substrate 50 at intervals; wiring 30 formed between the first electrode layer 10 and the first electrode layer 10 adjacent to each other; an insulating protection film 60 which covers the semiconductor substrate 50 and the wiring 30 between the first electrode layer 10 and the first electrode layer 10 adjacent to each other; and a plurality of second electrode layers 20 formed on the plurality of first electrode layers 10, respectively. The second electrode layers 20 cover an end 61 of the protection film 60 and the protection film 60 is exposed from between the second electrode layer and the second electrode layer 20 adjacent to each other.
Inventors:
NARITA KATSUTOSHI
Application Number:
JP2014108068A
Publication Date:
December 14, 2015
Filing Date:
May 26, 2014
Export Citation:
Assignee:
TOYOTA MOTOR CORP
International Classes:
H01L21/3205; H01L21/60; H01L21/768; H01L23/522
Attorney, Agent or Firm:
Kaiyu International Patent Office