To provide a semiconductor device, where the adhesion of a substrate for mounting a semiconductor material to a mounting substrate is high, and to provide a manufacturing method for the device.

A semiconductor device is constituted in a structure, such that one surface of a substrate 10 for mounting a semiconductor material of a constitution, where a land 3 and copper wirings 14 are formed on the surface of a glass epoxy substrate 11 and a solder resist 15 is formed on the land 13 and the wirigns 14, is roughened and a semiconductor chip 20 is mounted on the other surface of the substrate 10. Through-holes 23 for leading to the wirings 14 are formed in the resist 15, and solder balls 24 are formed on the wirings 14 with the exposed surfaces. The balls 24 are thermally pressure-bonded to pads on a mounting substrate 30, and an underfill material 32 is injected between the substrate 10 and the substrate 30. Since the surface of the substrate 10 is roughened, the connection area of the substrate 10 with the material 32 is large, and the adhesion of the substrate 10 to the substrate 30 is enhanced.