Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP3726089
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To facilitate the manufacturing of a semiconductor device with a wiring structure and to decrease an inter-wire capacitance without decreasing the cross-sectional area of wires.
SOLUTION: The wires comprises wires 11 each having a convex shaped cross-section with a short side and a long side opposed to the short side, and wires 12 each having an inverted convex shaped cross-section with a short side and a long side opposed to the short side; and the wires 11 and 12 are laid out via an insulating film 10 so that the short side of the wires 11 and the long side of the wires 12 are alternately located.
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Inventors:
Hiroki Komatsubara
Application Number:
JP2003139729A
Publication Date:
December 14, 2005
Filing Date:
May 19, 2003
Export Citation:
Assignee:
Oki Electric Industry Co., Ltd.
International Classes:
H01L21/3205; H01L21/4763; H01L21/768; H01L23/52; H01L23/522; H01L23/528; (IPC1-7): H01L21/3205
Domestic Patent References:
| JP4023327A | ||||
| JP2001917A |
Attorney, Agent or Firm:
Toshiaki Suzuki