Title:
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2008251786
Kind Code:
A
Abstract:
To provide a technique for increasing a reliability in a semiconductor device.
A semiconductor device comprises a semiconductor chip (first semiconductor chip) 3 having a main surface (first main surface) 3a and a main surface (second main surface) 3b located at a position opposed to the main surface 3a, a lead frame (carrier substrate) for carrying the semiconductor chip 3, a resin film (first film layer) 7 tightly mounted onto the main surface 3b of the semiconductor chip 3, and an adhesive (first adhesive layer) 8 for tightly mounting the semiconductor chip 3 onto the lead frame. The Young's modulus of the adhesive 8 is set to be smaller than the Young's modulus of the resin film 7.
Inventors:
KANEMOTO KOICHI
KIKUCHI TAKU
SUZUKI KAZUNARI
SHIOTSUKI TOSHIHIRO
KIKUCHI TAKU
SUZUKI KAZUNARI
SHIOTSUKI TOSHIHIRO
Application Number:
JP2007090558A
Publication Date:
October 16, 2008
Filing Date:
March 30, 2007
Export Citation:
Assignee:
RENESAS TECH CORP
International Classes:
H01L21/52; H01L25/065; H01L25/07; H01L25/18
Attorney, Agent or Firm:
Yamato Tsutsui