Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2012064855
Kind Code:
A
Abstract:
To provide a semiconductor device with high reliability.
In a semiconductor device 10, a circuit board 30 includes a metallic circuit 32 having a chip mounting part 34 and terminal mounting parts 36a, 36b and 36c with a concave-convex part 35. A semiconductor chip 11 is connected through a first solder layer 12 to the chip mounting part 34. End parts of electrode terminals 16, 20 and 24 are facing substantially in parallel with the surface of the metallic circuit 32, connected to the terminal mounting parts 36a, 36b and 36c through second solder layers 17, 21 and 25 provided so as to fill the concave-convex part 35, and electrically connected to the semiconductor chip 11.
Inventors:
MATSUOKA NOBUTAKA
HIGASHI NORIYUKI
HIGASHI NORIYUKI
Application Number:
JP2010209233A
Publication Date:
March 29, 2012
Filing Date:
September 17, 2010
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01L23/48
Attorney, Agent or Firm:
Masayuki Sunai
Fujiwara Yasutaka
Hajime Yamashita
Fujiwara Yasutaka
Hajime Yamashita