Title:
Semiconductor device
Document Type and Number:
Japanese Patent JP6213554
Kind Code:
B2
Abstract:
Provided is a small and thin semiconductor device while preventing contamination of a wire bonding terminal caused by creeping-up of a die bond. The semiconductor device includes: a first semiconductor chip having a main surface formed with electrodes; an extension part extended outward from a side end surface of the first semiconductor chip; a rewiring layer formed from the main surface of the first semiconductor chip to a first surface of the extension part; a connection terminal provided on the rewiring layer of the extension part; a die bond that fixes the first semiconductor chip and the extension part to a substrate; and in the extension part, a step outside the connection terminal.
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Inventors:
Shigeshi Doi
Application Number:
JP2015501087A
Publication Date:
October 18, 2017
Filing Date:
October 03, 2013
Export Citation:
Assignee:
Panasonic Corporation
International Classes:
H01L25/04; H01L21/52; H01L21/60; H01L23/12; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP200712716A | ||||
| JP2000138238A |
Foreign References:
| WO2012107972A1 |
Attorney, Agent or Firm:
Tokuda Yoshiaki
Hiroki Nishida
Hiroki Nishida