PURPOSE: To improve heat dissipation of a semiconductor chip, and seal the semiconductor chips and surface mount parts, regarding a semiconductor device in which a plurality of semiconductor chips and other mounting parts are packaged and sealed.
CONSTITUTION: A metal plate 22 of a specified thickness soldered and bonded to the rear of a semiconductor chip 2 which is so selected that the upper surface becomes higher than the mounting height of a surface mounting parts 4, and the other metal plate 23 of a specified thickness which is so soldered and bonded to the rear of the other semiconductor chip 3 that the height up provided. A metal frame body 30 which is mounted on a semiconductor substrate 1, so as to surround the semiconductor chips 2, 3 and a surface mount parts 4, and has height equal to that of the upper surface of the metal plate 22, and a heat dissipating body 35 whose rear is soldered and bonded to the upper surfaces of the metal plates 22, 23, and the upper surface of the metal frame body 30 and whose plane shape is equal to that of the metal frame body 30 are provided.
| JP2014203919 | SEMICONDUCTOR DEVICE |
| JP7213687 | Heat dissipation device |
| JPH01220852 | SEMICONDUCTOR DEVICE |
TSUBONE KENICHIRO
TAKABAYASHI HIROYUKI
SUGINO SHIGERU
Next Patent: MULTICHIP MODULE