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Title:
半導体装置
Document Type and Number:
Japanese Patent JP7085974
Kind Code:
B2
Abstract:
A first lead and a second lead are adjacent. The first lead has a first sinking portion. The second lead has a second sinking portion. The first sinking portion and the second sinking portion are opposed so that the first sinking portion and the second sinking portion sandwich a space. The first sinking portion and the second sinking portion are configured so that the first sinking portion presses a first electrode, and the second sinking portion presses a second electrode in a containing state.

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Inventors:
Kazuhiko Tsukuriya
Application Number:
JP2018233041A
Publication Date:
June 17, 2022
Filing Date:
December 13, 2018
Export Citation:
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Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L23/50
Domestic Patent References:
JP6021321A
Attorney, Agent or Firm:
Hidetoshi Yoshitake
Takahiro Arita



 
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