To provide a semiconductor manufacturing device equipped with an air cylinder which reduces operation speed only in the vicinity of a semiconductor wafer or a semiconductor pellet and which reduces stress during contact, without making the device large, and without slowing the operation speed in the midst of moving up and down when a movable attracting part approaches the semiconductor wafer or the semiconductor pellet.

In a semiconductor pellet transfer equipment having the movable attracting part 3 which approaches the pellet 2 from a position separate from the pellet 2 and which is brought into abutment with the pellet 2, a mechanism for driving the attracting part 3 is characterized by being the air cylinder 102 with a built-in compressing coil spring 103.