Title:
SEMICONDUCTOR WAFER GRINDING MACHINE
Document Type and Number:
Japanese Patent JP2004095771
Kind Code:
A
Abstract:
To clean and remove cutting powder or abrasives generated by grinding without deforming the flat surface shape of suction surfaces so as to maintain the suction surface for sucking a semiconductor wafer clean.
A semiconductor wafer grinding machine includes an injection nozzle (45) for injecting fluid as a cleaning medium by an injection pressure to give a cleaning effect to the suction surface (2) of the state in which the wafer (10) is removed to an exposed state, and openable dustproof covers (70), (80) for covering the grinding surface (11) of the wafer (10) of a region not opposing the grindstone (30). The nozzle (45) is mounted at a dustproof cover (90).
Inventors:
MURAI SHIRO
KAWAZU TOMOYUKI
OKUYAMA TETSUO
SAIDA KUNIHIRO
KAWAZU TOMOYUKI
OKUYAMA TETSUO
SAIDA KUNIHIRO
Application Number:
JP2002253681A
Publication Date:
March 25, 2004
Filing Date:
August 30, 2002
Export Citation:
Assignee:
NIPPEI TOYAMA CORP
International Classes:
B24B7/04; B24B7/22; B24B55/06; H01L21/304; (IPC1-7): H01L21/304; B24B7/04; B24B7/22; B24B55/06
Attorney, Agent or Firm:
Isono Dozo
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