Title:
SEMICONDUCTOR WAFER HEATING DEVICE, AND SEMICONDUCTOR WAFER HEATING METHOD
Document Type and Number:
Japanese Patent JP2009182321
Kind Code:
A
Abstract:
To provide a semiconductor wafer heating device capable of uniformly heating a semiconductor wafer.
The semiconductor wafer heating device is provided with a plurality of sensors 105-107 and 250-253 for detecting the warpage of the semiconductor wafer 104, a plurality of heating zones 201 and 215 for supplying different amounts of heat independently to the different positions of the semiconductor wafer corresponding to the warp of the semiconductor wafer detected by the sensors, and a controller 108 for controlling the plurality of heating zones on the basis of the detected result of the sensors.
Inventors:
NAKAGAWA SEIJI
Application Number:
JP2008275564A
Publication Date:
August 13, 2009
Filing Date:
October 27, 2008
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01L21/027
Domestic Patent References:
| JP2007317732A | 2007-12-06 | |||
| JP2003282461A | 2003-10-03 | |||
| JP2007300047A | 2007-11-15 |
Attorney, Agent or Firm:
Takehiko Suzue
Kurata Masatoshi
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Tetsuya Kazama
Katsumura Hiro
Shoji Kawai
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori
Takuzo Ichihara
Yamashita Gen
Kurata Masatoshi
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Tetsuya Kazama
Katsumura Hiro
Shoji Kawai
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori
Takuzo Ichihara
Yamashita Gen
Previous Patent: ORGANIC ELECTROLUMINESCENT DISPLAY AND METHOD OF MANUFACTURING THE SAME
Next Patent: SEMICONDUCTOR WAFER EXPOSURE APPARATUS AND METHOD
Next Patent: SEMICONDUCTOR WAFER EXPOSURE APPARATUS AND METHOD