PURPOSE: To improve heat radiating rate and easiness of assembly, by forming an earth patterns of a modular printed wiring board so as to be brought into contact with respective connecting faces of an upper case and a lower case, and by mounting a signal transmission component, through which a signal transmission is performed between the inner circuit of the case structure and the outer circuit thereof, so as to penetrate through the part at which three faces of the modular printed wiring board, the upper case and the lower case are connected each other.
CONSTITUTION: An earth pattern 30 is formed widely on both of the surfaces of a modular printed wiring board 8 to which an upper case 4 and a lower case 6 are connected respectively. And a through type capacitor 10 is so mounted as to be brought into contact with the earth patterns 30 of the board 8, and a cutout part 28 is previously formed in the mounting portion both of the upper case 4 and the lower case 6. When the signal transmission component 10 is a coaxial connector, there is a structure in which the outer conductor thereof is connected with the earth pattern 30 of the board 8. Therefore, it is possible to stabilize grounding of the board within the case structure, to improve radiating rate of the electronic parts on the board, and to improve easiness of assembly operation of the case structure.
| WO/2014/063060 | RADIO FREQUENCY FILTER ASSEMBLY |
| JPH1117386 | ALTERNATING FIELD SHIELDING FILM AND MANUFACTURE THEREOF |
| JPH03280559 | CHIP CARRIER |
SUGANO TAKU
SATO TAKASHI
UMAGOME RIICHI
HONGO TOMOYUKI
