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Patent Searching and Data


Title:
SILICON NITRIDE/ALUMINUM COMPOSITE MATERIAL AND ITS PRODUCTION
Document Type and Number:
Japanese Patent JP2000335975
Kind Code:
A
Abstract:

To obtain the subject composite material with high mechanical strength, excellent in thermal conductivity, therefore suitable as a heat-radiative substrate or sliding part.

This composite material is such one as to be composed of Al or Si matrix and Si3N4 skeleton where columnar Si3N4 grains each ≥5 in mean aspect ratio (major axis/minor axis) are mutually and randomly bound in a three-dimensional manner through at least one rare earth element oxide binding phase, having a relative density of ≥98% and thermal conductivity of ≥130 W/mK.


Inventors:
KAWAI CHIHIRO
Application Number:
JP14838699A
Publication Date:
December 05, 2000
Filing Date:
May 27, 1999
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
C04B35/584; C22C29/16; (IPC1-7): C04B35/584; C22C29/16
Attorney, Agent or Firm:
Hidetake Komatsu (2 outside)