SILVER PLATING SOLUTION FOR HIGH-SPEED ELECTROPLATING

Title:

SILVER PLATING SOLUTION FOR HIGH-SPEED ELECTROPLATING

Document Type and Number:

Japanese Patent JPS62247094

Kind Code:

A

Abstract:

PURPOSE:To increase plating speed and to improve uniformity in plating and covering power by adding alcohol and an alkali metallic cyanide to a product prepd. by reacting selenium dioxide with acetylacetone and by adding a specified amount of the resulting additive to a silver plating soln. CONSTITUTION:An additive contg. selenium is added to a silver plating soln. contg. silver cyanide, an alkali metallic cyanide and an alkali metallic carbonate or hydroxide so that the concn. of selenium in the plating soln. is regulated to 0.1-5.0ppm. The additive is prepd. by adding 1-3C alcohol and an alkali metallic cyanide to a product prepd. by reacting selenium dioxide with acetylacetone. The resulting plating soln. enables plating at high current density and can give a smooth and lustrous finished surface.

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Inventors:

NANGO SHIGEYUKI

Application Number:

JP8871386A

Publication Date:

October 28, 1987

Filing Date:

April 17, 1986

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP

International Classes:

C25D3/46; (IPC1-7): C25D3/46

Domestic Patent References:

JPS4948388A	1974-05-10
JP43002846A

Attorney, Agent or Firm:

Mamoru Takada (1 person outside)

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