Title:
はんだ合金
Document Type and Number:
Japanese Patent JP6848859
Kind Code:
B2
Abstract:
In order to improve the strength and elongation of a solder and improve the reliability of a joining portion joined by the solder, the present invention provides a solder alloy that comprises 2.0 to 4.0 mass % of Ag, 0.5 to 1.0 mass % of Cu, 0.1 to 0.5 mass % of an additive element selected from the group consisting of Ca and Mn, and a balance of Sn.
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| JP2023153934 | SOLDER PARTICLES |
| JP2000326088 | LEAD-FREE SOLDER |
| WO/2012/116846 | PASTE FOR JOINING COMPONENTS OF ELECTRONIC MODULES, SYSTEM AND METHOD FOR APPLYING THE PASTE |
Inventors:
Yuki Momagawa
Application Number:
JP2017518741A
Publication Date:
March 24, 2021
Filing Date:
April 25, 2016
Export Citation:
Assignee:
NEC
International Classes:
B23K35/26; B23K35/22; C22C13/00; H05K3/34
Domestic Patent References:
| JP2008031550A | ||||
| JP2004261863A | ||||
| JP2010247167A | ||||
| JP2014160822A |
Foreign References:
| US20100203353 | ||||
| US5527628 |
Attorney, Agent or Firm:
Masahiko Desk
Naoki Shimosaka
Naoki Shimosaka