Title:
半田処理装置
Document Type and Number:
Japanese Patent JP6792858
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide solder treatment equipment capable of using the heat of an iron tip to surely melt a solder chip on heating, and to cause molten solder to surely flow out of the solder tip.SOLUTION: Solder treatment equipment has a vertically extending nearly cylindrical iron tip capable of heating, a solder chip supplying part that supplies a solder chip from above into the iron tip, and a gas supplying part that supplies pressurized air into the iron tip, uses the heat of the iron tip to melt the solder chip, and supplies the molten solder downward, where the interior of the iron tip is provided with a receiving part that receives the supplied solder chip to make a configuration of melting the solder chip above the receiving part on a forcible contact with the inner wall of the iron tip, supplying the pressurized air from the gas supplying part into the iron tip, and extruding molten solder out of the iron tip.SELECTED DRAWING: Figure 6
Inventors:
Mitsuo Ebisawa
Application Number:
JP2016150939A
Publication Date:
December 02, 2020
Filing Date:
August 01, 2016
Export Citation:
Assignee:
AND Co., Ltd.
International Classes:
B23K3/06; B23K1/00; B23K3/02; H05K3/34
Domestic Patent References:
| JP2053873U | ||||
| JP59064162A | ||||
| JP2016100383A | ||||
| JP2014146630A | ||||
| JP47022220U |
Attorney, Agent or Firm:
Shigeki Yamada