Title:
SOLDERING INSPECTION DEVICE
Document Type and Number:
Japanese Patent JPH11101620
Kind Code:
A
Abstract:
To correctly make a further detailed judgment on a soldered state without being affected by the shape or the like of an electrode.
An image of a soldered electrode is obtained by a camera device 8, and this image is sent to a data processor. A CPU 61 computes a luminance histogram of the image. A neural network 65 is provided and is previously put through learning with the luminance histogram of the image as an input signal and with the visual evaluation value of the soldered state of the electrode as a teacher signal. The luminance histogram of the soldered electrode to be an inspection object is inputted to the neural network 65 to obtain the evaluation value of the soldered electrode.
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Inventors:
ARAKAWA TOMOHIRO
Application Number:
JP27984397A
Publication Date:
April 13, 1999
Filing Date:
September 26, 1997
Export Citation:
Assignee:
TOYOTA CENTRAL RES & DEV
TOYOTA AUTO BODY CO LTD
TOYOTA AUTO BODY CO LTD
International Classes:
G01B11/24; G01B21/00; (IPC1-7): G01B11/24; G01B21/00
Domestic Patent References:
JPH06174444A | 1994-06-24 | |||
JPH0712530A | 1995-01-17 | |||
JPH0694643A | 1994-04-08 |
Attorney, Agent or Firm:
Kenichi Morita
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