Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
Substrate processing device
Document Type and Number:
Japanese Patent JP6016330
Kind Code:
B2
More Like This:
JP5555460A manufacturing method of a polishing pad and a polishing pad
JP2022159069CMP POLISHING PAD WITH ENHANCED POLISHING RATE
JP5885396Device chip manufacturing method
Inventors:
Nobuyuki Miyaji
Takashi Izuda
Application Number:
JP2011069380A
Publication Date:
October 26, 2016
Filing Date:
March 28, 2011
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/304; H01L21/306
Domestic Patent References:
JP2002151455A
JP11121420A
JP2002113429A
Attorney, Agent or Firm:
Masahiro Matsusaka
Tsutomu Tanaka
Masamichi Ida



 
Previous Patent: Quality for lithium ion batteries of cathode active material, an anode for lithium ion batteries, an...

Next Patent: JPS6016331