SUBSTRATE SEPARATING DEVICE - Sharp Corporation

Title:

SUBSTRATE SEPARATING DEVICE

Document Type and Number:

Japanese Patent JP3565336

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a substrate separating device capable of surely separating a substrate without giving an adverse effect to the substrate, in the case of separating the substrate of soft thin plate state from an auxiliary jig.
SOLUTION: This substrate separating device 1 reduces ionized compressed air 14 by an air knife 9 injected to a temporary fixed mating joint between a substrate 24 and an auxiliary jig 25, so as to separate the substrate 24. By directly injecting air toward the temporary fixed mating joint, the substrate is surely separated. Since separation is by air, mechanical contact relating to the substrate 24 is eliminated, so that the substrate 24 can be prevented from flawing. Since air is the ionized compressed air 14, static electricity generated in the case of separation is neutralized, so that a bad influence given to a thin film electrode or the like formed on the substrate 24 can be impeded by performing its static elimination.

Inventors:

Yasuyuki Kawakami

Application Number:

JP2001083712A

Publication Date:

September 15, 2004

Filing Date:

October 07, 1994

Export Citation:

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