Title:
Substrate treating method
Document Type and Number:
Japanese Patent JP5979700
Kind Code:
B2
Abstract:
A substrate processing apparatus comprising a substrate holding rotating mechanism, a process liquid supply mechanism having a nozzle for dispensing a process liquid toward a principal face of the substrate, a processing liquid reservoir for holding sufficient process liquid to form a liquid film covering the whole principal face of the substrate, a liquid film forming unit for forming the liquid film by supplying the process liquid onto the principal face of the substrate in a single burst, and a control unit for controlling the liquid film forming unit and the process liquid supply mechanism such that the process liquid is dispensed from the process liquid nozzle toward the principal face of the substrate after formation of the liquid film covering the whole area of the principal face of the substrate by the liquid film forming unit.
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Inventors:
Masahiro Miyagi
Mitsuharu Hashimoto
Toru Endo
Mitsuharu Hashimoto
Toru Endo
Application Number:
JP2011213272A
Publication Date:
August 24, 2016
Filing Date:
September 28, 2011
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/306; H01L21/304
Domestic Patent References:
| JP2001230198A | ||||
| JP10146560A | ||||
| JP10308381A | ||||
| JP2005044866A | ||||
| JP10309806A | ||||
| JP2000195833A | ||||
| JP11028412A | ||||
| JP2000173905A |
Attorney, Agent or Firm:
Inaoka cultivation
Mio Kawasaki
Mio Kawasaki
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