Title:
TAB TAPE FOR BGA AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2005217215
Kind Code:
A
Abstract:
To manufacture a compact and inexpensive TAB tape for BGA without deteriorating the adhesiveness of an insulating tape and a solder ball land.
The upper face and the lower face of an insulating tape 22 are conducted by conductive insertion pins 31 and 32. It is desired that the roots of the insertion pins 31 and 32 are formed with a plane pad 31b or a ball 32b. The insertion pins 31 and 32 are inserted from the lower face of the tape so that the tape can be connected to an electric wiring board by using the plane pad 31b or the ball 32b arranged on the lower face of the tape. It is desired that a repairing tool may be used for the inserting operation of the plurality of insertion pins.
Inventors:
HIRATSUKA HIROAKI
OMORI TERUYUKI
KOJIMA HIDEKAZU
ISAKA FUMIYA
SAEKI MASAHIKO
KISHINO KAZUHISA
OMORI TERUYUKI
KOJIMA HIDEKAZU
ISAKA FUMIYA
SAEKI MASAHIKO
KISHINO KAZUHISA
Application Number:
JP2004022508A
Publication Date:
August 11, 2005
Filing Date:
January 30, 2004
Export Citation:
Assignee:
HITACHI CABLE
International Classes:
H01L21/60; (IPC1-7): H01L21/60