TEMPERATURE SENSOR

Japanese Patent JP2671736

B2

PURPOSE: To obtain a temperature sensor which has a small size, can be increased in degree of freedom for shape, and can be molded in various shapes by combining a molded body of an organic resin mixed with a filler, the refractive index of which coincides with that of the resin at a specific temperature, and a light receiving device which detects the quantity of light transmitted through the molded body.
CONSTITUTION: A light emitting and receiving devices are sealed in a molded body 2 of an organic resin and the outer peripheral surface of the molded body 2 is coated with a light shielding layer 6 so as to eliminate the influences of external light. The title sensor is constituted of a light receiving element 1, the molded body 2, lead wire 3 connected to the element 1, light emitting element 4, lead wire 5 connected to the element 4, and layer 6. The layer 6 can be formed of a molded body of a resin. When the sensor is connected to a device which converts light transmissivity into a temperature through the lead wire 3, the sensor functions as a temperature sensor. Such a device that stores the relation between the light transmissivity measured by the sensor and the then temperature in a personal computer as a function and, at the actual measuring time, outputs the temperature when the light transmissivity measured by the sensor is inputted can be used.

Toshio Shiobara
Koji Nimori
Kazuhiro Arai

JP32361592A

October 29, 1997

November 09, 1992

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Shin-Etsu Chemical Co., Ltd.

G01K11/12; G01K11/16; G01K11/18; (IPC1-7): G01K11/12; G01K11/16; G01K11/18

JP55122124A
JP4204337A

Takashi Kojima

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