Title:
端子圧着機、サーボプレス、端子圧着電線製造装置、及び、端子圧着電線の製造方法
Document Type and Number:
Japanese Patent JP7399201
Kind Code:
B2
Abstract:
The invention provides a stripping device for a coating layer of an electric wire. The stripping device can reliably drop coating layer broken chips which are firmly attached. An electric wire coating layer peeling device (23, 33) is provided with: a plurality of peeling blades (231, 233) provided in pairs, the plurality of peeling blades (231, 233) cutting notches in a coating layer at the end of an electric wire (W) from two directions; and a jig (211) that grips the base-side portion of the end portion of the electric wire. The electric wire coating stripping device (23, 33) further comprises a coating broken chip knock-off member (241), and the coating broken chip knock-off member (241) is driven in a reciprocating mode between a position where the coating broken chip knock-off member (241) makes contact with a coating part (WK) ((D) in figure 4) attached to the front side of the stripping blades (231, 233) and a position where the coating broken chip knock-off member (241) is separated from the position.
Inventors:
Ryoichi Ozawa
Masahiro Takahashi
Seiichi Suzuki
Masahiro Takahashi
Seiichi Suzuki
Application Number:
JP2022011555A
Publication Date:
December 15, 2023
Filing Date:
January 28, 2022
Export Citation:
Assignee:
Nippon Automatic Machine Co., Ltd.
International Classes:
H01R43/048; H02G1/12; H02G1/14
Domestic Patent References:
JP745352A | ||||
JP634893U | ||||
JP200348098A | ||||
JP9330779A | ||||
JP5159847A | ||||
JP2000138087A | ||||
JP2010277703A |
Foreign References:
US5046241 |
Attorney, Agent or Firm:
Watanabe Atsushi
Hiroaki Inada
Hiroaki Inada