Title:
熱硬化型樹脂組成物、その硬化物およびプリント配線板用層間接着フィルム
Document Type and Number:
Japanese Patent JP5278785
Kind Code:
B2
Abstract:
There is provided a thermosetting polyimide resin composition which enables production of a cured product exhibiting excellent dimensional stability and which exhibits excellent meltability at low temperature in a semicured state (in the B-stage) and excellent flame resistance in a completely cured state; there are also provided a cured product of such a composition and an interlaminar adhesive film used for a printed wiring board, the interlaminar adhesive film being formed of the composition. In particular, there are provided a thermosetting polyimide resin composition containing a thermosetting polyimide resin (A) having a biphenyl backbone directly linked to a nitrogen atom of a five-membered cyclic imide backbone and a weight-average molecular weight (Mw) of 3,000 to 150,000, a phosphorus compound (B) represented by specific Formula (bl) or (b2), and an epoxy resin (C); a cured product of such a composition; and an interlaminar adhesive film used for a printed wiring board, the interlaminar adhesive film including a layer formed of the composition, the layer being formed on a carrier film.
Inventors:
Eiju Ichinose
Takashi Mihara
Masaki Sako
Koichi Murakami
Atsushi Miyagaki
Takashi Mihara
Masaki Sako
Koichi Murakami
Atsushi Miyagaki
Application Number:
JP2012555898A
Publication Date:
September 04, 2013
Filing Date:
January 31, 2012
Export Citation:
Assignee:
DIC Corporation
International Classes:
C08G59/40; C08G73/10; C08K5/49; C08K5/53; C08L63/00; C09J7/35; C09J11/06; C09J163/00; C09J179/08; H05K3/38; H05K3/46
Domestic Patent References:
| JP2007224242A | 2007-09-06 | |||
| JP2010202865A | 2010-09-16 |
Foreign References:
| WO2010098296A1 | 2010-09-02 |
Attorney, Agent or Firm:
Kono Tsuyo