PURPOSE: To connect terminal at ultra-fine pitch and to perform a high-density surface mounting operation by a method wherein two conductors are connected by conductive material, the nonconductive material is interposed in a part other than the conductors and the conductive material and the nonconductive material contain a double conjugate polymer in a main skeleton.
CONSTITUTION: A film 81 composed mainly of a conductive polymer provided with a conjugated double linkage in a main chain skeleton is formed on a circuit board 1. Light is shone at parts other than the connecting terminals from the surface side of the circuit board 1 via a photomask 9, only the parts corresponding to the connecting terminals 12 are left as conductor parts 810, and the conductive polymer in other parts is used selectively as high-resistance parts 820. After that, the conductive parts 810 and connecting terminals 22 for an LSI chip 2 are aligned, they are thermocompression-bonded, and the circuit board 1 is connected to the LSI chip 2. In this case, the insulation between the the terminals 12 is kept by the high-resistance parts 820. Thereby, the terminals can be connected at ultra-fine pitch, simply and at low costs.
UEDA KIE
KISHIMOTO MUNEHISA
NAKAMURA SHOZO
HASEBE AKIO
