Title:
【発明の名称】低誘電率を有する弗素化樹脂
Document Type and Number:
Japanese Patent JPH07507269
Kind Code:
A
Abstract:
A highly fluorinated benzene compound is reacted with acryloyl chloride to yield a fluorinated liquid product which is used to impregnate a reinforcing structure. Upon impregnation, the liquid material is polymerized at about 55 DEG C. to produce a reinforced polymeric structure, which can be a circuit board. The polymer has dielectric constant of about 2.1, which is very low compared to the polymers used presently.
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Inventors:
Griffith, James Earl.
Fu, Henry S. W.
Fu, Henry S. W.
Application Number:
JP51483093A
Publication Date:
August 10, 1995
Filing Date:
January 27, 1993
Export Citation:
Assignee:
THE UNITED STATES OF AMERICA
International Classes:
C07C43/174; C07C43/225; C07C69/54; C07C69/653; C07C323/16; C08F16/26; C08F20/22; C08F20/30; C08L33/04; C08L33/16; H05K1/03; (IPC1-7): C07C43/174; C07C43/225; C07C69/54; C07C323/16; C08F20/22; C08L33/16; H05K1/03
Attorney, Agent or Firm:
Hidekazu Miyoshi (1 outside)