Title:
【発明の名称】トランスファモールド機のリードフレーム供給装置
Document Type and Number:
Japanese Patent JP2872300
Kind Code:
B2
More Like This:
Inventors:
TOFUKUJI SHIGEYUKI
Application Number:
JP29546189A
Publication Date:
March 17, 1999
Filing Date:
November 14, 1989
Export Citation:
Assignee:
APITSUKU YAMADA KK
International Classes:
H01L21/56; B29C31/08; B29C45/02; B29C45/18; B29K105/22; B29L31/34; (IPC1-7): B29C45/02; B29C45/18; H01L21/56
Domestic Patent References:
| JP1186638A | ||||
| JP57181473A | ||||
| JP57187155A | ||||
| JP5372066A | ||||
| JP1252432A | ||||
| JP63104430A | ||||
| JP57181473U |
Attorney, Agent or Firm:
Takao Watanuki (1 outside)