Title:
WIRE BONDING METHOD
Document Type and Number:
Japanese Patent JP2000031192
Kind Code:
A
Abstract:
To enhance reliability and productivity of product by changing the size of initial ball between bump bonding and ball bonding so that bonding can be performed entirely in one process.
At the time of bump bonding lead side chip, a relay 37 is turned to the contact 33 side and a current flows through a resistor 32 to a torch lot 35 forming initial balls for bump bonding. Upon finishing final bump bonding of a lead side chip, the relay 37 is turned to the contact 34 side and a current is fed through a resistor 31 to the torch lot 35 in order to form initial balls for ball bonding thus performing ball bonding. Since bonding can be performed entirely in one process, reliability and productivity of product can be enhanced.
Inventors:
HORINOUCHI HIROSHI
Application Number:
JP19391198A
Publication Date:
January 28, 2000
Filing Date:
July 09, 1998
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Norio Ogo (1 outside)