Title:
WIRE AND WIRE SAW
Document Type and Number:
Japanese Patent JP2001198790
Kind Code:
A
Abstract:
To provide a wire capable of improving the accuracy of a cut shape of a workpiece to be cut and cutting efficiency and a wire saw provided with the wire.
An uneven section 141b is formed in the outer peripheral face of a strand 141a of the wire 141 for cutting and machining the workpiece to be cut while running in contact with the workpiece to be cut and coated with a plating film 141c. The plating membrane in the recessed section becomes thicker than that in other sections because plating membrane goes more into the recessed section. The free abrasive grains used in cutting the workpiece to be cut is stuck in the plating membrane deeply. As a result, the holding force of free abrasive grains can be improved.
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Inventors:
NEHASHI SABURO
Application Number:
JP2000009346A
Publication Date:
July 24, 2001
Filing Date:
January 18, 2000
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
B24B27/06; B28D5/04; C25D7/06; (IPC1-7): B24B27/06; B28D5/04; C25D7/06
Domestic Patent References:
JPH1110514A | 1999-01-19 | |||
JPH0479050U | 1992-07-09 | |||
JPS61121817A | 1986-06-09 | |||
JPS6317755U | 1988-02-05 | |||
JPS6452646U | 1989-03-31 |
Attorney, Agent or Firm:
Kisaburo Suzuki (2 outside)
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