Title:
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2018195776
Kind Code:
A
Abstract:
To provide a wiring board that can stably operate an electronic component by reducing peeling of wiring conductors, and a method for manufacturing the same.SOLUTION: A wiring board comprises: an insulating layer 3; wiring conductors 5 that are located on the surface of the insulating layer 3; and a solder resist 6 that is located on the surface of the insulating layer 3 and the surface of the wiring conductors 5, and has concave parts 12 that expose parts of the wiring conductors 5. The wiring conductors 5 each have a first conductor 9 that is in direct contact with the surface of the insulating layer 3, a barrier metal 10 that entirely covers the top face of the first conductor 9, and a second conductor 11 that is located on the top face of the barrier metal 10. In the concave part 12, the solder resist 6 covers the side face of the first conductor 9 and the side face of the barrier metal 10, and the top face of the second conductor 11 is located above the top face of the solder resist 6.SELECTED DRAWING: Figure 2
Inventors:
TADA KIMINORI
Application Number:
JP2017100706A
Publication Date:
December 06, 2018
Filing Date:
May 22, 2017
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H05K3/34; H05K1/09; H05K3/28