Title:
WIRING EQUIPMENT FOR PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH0563354
Kind Code:
A
Abstract:
PURPOSE: To obtain a wiring equipment for a printed wiring board which equipment is suitable for automating.
CONSTITUTION: The title equipment is constituted of the following; a thermal sublimation covered wire 28 which is wound so as to be capable of leading-out, a clumper 32 which can move while retaining the wire 28, a heater chip 34 which presses a led-out wire against a printed wiring board and heats the wire, a means for eliminating the coating, and a cutter 44 for applying a mark to the wire.
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Inventors:
ICHIHARA YASUHIRO
KUROKAWA TETSUO
KUROKAWA TETSUO
Application Number:
JP22401591A
Publication Date:
March 12, 1993
Filing Date:
September 04, 1991
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H05K3/22; H05K3/34; (IPC1-7): H05K3/22; H05K3/34
Attorney, Agent or Firm:
Matsumoto
Next Patent: MOUNT ASSEMBLING METHOD FOR ELECTRONIC PARTS