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Title:
An adhesive composition, film adhesive, an adhesion sheet, and a semiconductor device
Document Type and Number:
Japanese Patent JP5910630
Kind Code:
B2
Abstract:
The present invention provides an adhesive composition which comprises a polyurethane resin and a thermosetting component and which exhibits a flow of 500µm or more in B-stage at 120°C and a flow of less than 500µm in C-stage at 120°C and satisfies the relationship: (A) - (B) = 100µm [wherein (A) is the flow in B-stage at 120°C, and (B) is the flow in C-stage at 120°C].

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Inventors:
Takashi Masuko
Satoshi Kurosawa
Hiroyuki Izawa
Application Number:
JP2013516253A
Publication Date:
April 27, 2016
Filing Date:
April 20, 2012
Export Citation:
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Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C09J175/04; C09J4/06; C09J7/35; C09J11/04; C09J163/00; H01L21/301; H01L21/52; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
JPH10178066A1998-06-30
JPH0912984A1997-01-14
JP2010024431A2010-02-04
JP2011029232A2011-02-10
JP2011190424A2011-09-29
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Junichiro Sakamaki
Toshiaki Sakanishi



 
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