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Title:
A method for film deposition and a film deposition system
Document Type and Number:
Japanese Patent JP6020239
Kind Code:
B2
Abstract:
A method for depositing a film is provided. In the method, an object to be processed is accommodated in a process chamber, and an insulating film made of a polymer thin film is deposited on a surface of the object to be processed by supplying a first source gas composed of an acid anhydride and a second source gas composed of a diamine into the process chamber that is evacuated. Next, the insulating film is modified so as to have a barrier function by stopping the supply of the second source gas into the process chamber and continuously supplying the first source gas into the process chamber.

Inventors:
Yoshihei Sugita
Hiroyuki Hashimoto
Muneo Harada
Application Number:
JP2013027972A
Publication Date:
November 02, 2016
Filing Date:
February 15, 2013
Export Citation:
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Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/312; H01L21/3205; H01L21/768; H01L23/522; H01L23/532
Domestic Patent References:
JP3013561A
JP61261322A
JP2000021866A
JP2002275619A
JP2012015195A
JP2001085419A
Foreign References:
WO2012001848A1
Attorney, Agent or Firm:
Akihiro Asai



 
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