Title:
センサ装置
Document Type and Number:
Japanese Patent JP7268510
Kind Code:
B2
Abstract:
A sensor device (24) includes a partial assembly (44), a circuit board (43), and a sensor housing (45). The partial assembly (44) is constituted by selectively mounting a part that is at least one of a magnetism collection member (92) and a driven wheel (96, 97) to a holder (91). The circuit board (43) is provided with a detector (63, 64) configured to detect at least one of magnetic flux induced by the magnetism collection member and a rotational angle of the driven wheel in accordance with the part mounted to the holder (91). The sensor housing (45) is penetrated by the shaft (13), and houses the partial assembly (44) and the circuit board (43).
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Inventors:
Yuichi Toyama
Application Number:
JP2019127796A
Publication Date:
May 08, 2023
Filing Date:
July 09, 2019
Export Citation:
Assignee:
JTEKT Corporation
International Classes:
G01L3/10; B62D5/04; G01L5/22
Domestic Patent References:
| JP2008179248A | ||||
| JP2007216721A | ||||
| JP200876066A | ||||
| JP2014104921A | ||||
| JP2009228696A | ||||
| JP2019516990A | ||||
| JP2013538349A |
Foreign References:
| WO2008090878A1 |
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Hironobu Onda
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