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Title:
A wire electric discharge machining device, its control method, a program, a manufacturing method of a wafer.
Document Type and Number:
Japanese Patent JP6172229
Kind Code:
B2
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Inventors:
Hideshi Tsukamoto
Application Number:
JP2015174366A
Publication Date:
August 02, 2017
Filing Date:
September 04, 2015
Export Citation:
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Assignee:
Canon Marketing Japan Inc.
International Classes:
B23H7/02
Domestic Patent References:
JP2000107941A
JP61111844A
Attorney, Agent or Firm:
Hideki Ito



 
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