Title:
APPARATUS FOR THE APPLICATION OF DEVELOPING SOLUTION TO A SEMICONDUCTOR WAFER
Document Type and Number:
WIPO Patent Application WO2001066260
Kind Code:
A3
Abstract:
A wedge-shaped nozzle (70) for dispensing fluids onto a round surface (76) is disclosed. The nozzle (70) dispenses the fluid with a generally uniform volume of fluid per unit area of the round surface (76) to achieve rapidly a uniform thickness of applied fluid on the round surface (76). The wedge-shaped nozzle (70) has orifices (81) of equal size disposed on its bottom through which the fluid is dispensed. The orifices (81) are disposed along arcs (171), with increasing numbers of orifices (81) on the arcs (171) at greater and greater distances of the arcs (171) from the apex of the wedge-shaped nozzle (70). The numbers of the orifices (81) on each arc (171) are proportional to the area of an annular region determined by the arcs (171).
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Inventors:
PIKE CHRISTOPHER LEE
Application Number:
PCT/US2001/006517
Publication Date:
March 21, 2002
Filing Date:
February 27, 2001
Export Citation:
Assignee:
ADVANCED MICRO DEVICES INC (US)
International Classes:
B05C11/08; H01L21/00; (IPC1-7): B05C5/02; B05C11/08; H01L21/00
Foreign References:
| US5571560A | 1996-11-05 | |||
| US5902648A | 1999-05-11 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 008, no. 232 (C - 248) 25 October 1984 (1984-10-25)
PATENT ABSTRACTS OF JAPAN vol. 012, no. 184 (E - 614) 28 May 1988 (1988-05-28)
PATENT ABSTRACTS OF JAPAN vol. 012, no. 184 (E - 614) 28 May 1988 (1988-05-28)
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