Title:
APPARATUS AND METHOD FOR CONTROLLING GALVANIC CORROSION EFFECTS ON A SINGLE-WAFER CLEANING SYSTEM
Document Type and Number:
WIPO Patent Application WO2003007348
Kind Code:
A3
Abstract:
A method and apparatus for controlling galvanic corrosion effects on a single-wafer cleaning system are provided. In one embodiment, a method for minimizing galvanic corrosion effects in a single-wafer cleaning system is provided. The method initiates with applying a cleaning chemistry containing corrosion inhibitors to a surface of a wafer. Then, the surface of the wafer is exposed to the cleaning chemistry for a period of time. Next, a concentration gradient at an interface of the cleaning chemistry and the surface of the wafer is refreshed. Then, a rinsing agent and a drying agent are applied simultaneously to remove the cleaning chemistry , wherein the drying agent dries the surface of the wafer prior to a concentration of the corrosion inhibitors being diluted to a level insufficient to provide corrosion protection.
Inventors:
BOYD JOHN M (US)
RAVKIN MIKE (US)
MIKHAYLICH KATRINA A (US)
RAVKIN MIKE (US)
MIKHAYLICH KATRINA A (US)
Application Number:
PCT/US2002/022106
Publication Date:
August 21, 2003
Filing Date:
July 11, 2002
Export Citation:
Assignee:
LAM RES CORP (US)
BOYD JOHN M (US)
RAVKIN MIKE (US)
MIKHAYLICH KATRINA A (US)
BOYD JOHN M (US)
RAVKIN MIKE (US)
MIKHAYLICH KATRINA A (US)
International Classes:
H01L21/304; H01L21/00; H01L21/02; H01L21/311; H01L21/321; H01L21/306; (IPC1-7): H01L21/306; H01L21/00
Foreign References:
| US6247479B1 | 2001-06-19 | |||
| EP1039506A2 | 2000-09-27 | |||
| US6152153A | 2000-11-28 |
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